Used Canon Lithography Machine FPA-3030i5a

The Canon FPA-3030i5a, released in 2021, is an i-line stepper lithography system designed for substrates 8 inches (200mm) in diameter or smaller. It is primarily positioned to serve the manufacturing of compound semiconductors and specialty devices by offering a low cost of ownership (CoO), rather than targeting advanced process nodes.

The system utilizes a 365nm i-line exposure wavelength, achieves a resolution of ≤0.35μm, offers an overlay accuracy of ≤40nm, and features a 1:5 reduction ratio. Compared to its predecessor, the FPA-3030i5+, the i5a introduces key upgrades focused on process adaptability and cost-efficiency. It incorporates an off-axis alignment scope—which allows for mark measurement without passing through the projection lens—and supports dark-field alignment, significantly enhancing process robustness when handling challenging substrates, such as those that are highly warped or semi-transparent. It accommodates wafer sizes ranging from 50mm to 200mm and offers an optional Through-Silicon Alignment (TSA) feature, enabling the processing of compound semiconductors (e.g., silicon carbide and gallium nitride) as well as transparent substrates like glass and quartz.

In terms of performance, the system delivers a throughput of 123 wafers per hour for 8-inch substrates—an increase of approximately 17% over the previous generation—while a new chamber temperature control system reduces power consumption by about 20%. The FPA-3030i5a is well-suited for applications such as automotive power devices, 5G communication components, and double-sided MEMS processing; it serves as an i-line platform for mature process nodes that balances multi-material compatibility with low-cost, high-volume production.