Used TEL Track System LITHIUS™

TEL LITHIUS™ is a fully automated track system designed for 300mm (12-inch) wafers. It stands as one of the most iconic core lithography platforms developed by Tokyo Electron (TEL) for the 300mm era.

Core Positioning: A Hub for Advanced Lithography Processing

This system manages all chemical and thermal processing steps for wafers before and after exposure in a lithography scanner—including photoresist spin-coating, soft-baking, post-exposure baking (PEB), development, and hard-baking. LITHIUS is primarily deployed in production lines for advanced logic, memory (DRAM/NAND), and advanced packaging, serving as a critical tool for ensuring high-precision pattern transfer and critical dimension (CD) uniformity.

Key Technical Features

Highly Space-Efficient Cluster Architecture: Utilizing a unique design that combines vertical stacking with a horizontal, opposing-unit layout, the system achieves high integration of coating, thermal (hot plate), and development modules. This significantly reduces the equipment’s footprint while maintaining exceptionally high wafer-handling throughput.

Superior Micro-environment and Temperature Control: The system employs advanced micro-environment airflow control to effectively suppress particle contamination. Additionally, multi-zone precision thermal control on the hot plates ensures high uniformity during baking, meeting the stringent thermal budget requirements of advanced process nodes.

Seamless Integration and High Productivity: Equipped with standard FOUP loading/unloading interfaces and high-speed robotic handlers, the system can be directly integrated with various high-end immersion or EUV lithography scanners. It supports SECS/GEM communication protocols, allowing for seamless incorporation into fully automated 300mm production lines.

Summary

With its space-efficient architecture, exceptional process uniformity, and high throughput, TEL LITHIUS™ has become an indispensable core component of the lithography process for 300mm advanced manufacturing and advanced packaging production lines.