Used SINTAIKE STK-6120 Semi-automatic Wafer mounter

The SINTAIKE STK-6120 is a semi-automatic wafer taping machine designed to apply protective tape to semiconductor wafers prior to back-grinding or dicing, offering an optimal balance between operational flexibility and application quality.

Core Positioning: Flexible, Desktop-Class Processing

Featuring a semi-automatic operation mode—with manual wafer loading/unloading and automated taping and cutting—the STK-6120’s compact design makes it an ideal solution for R&D laboratories, high-mix/low-volume production, and the manufacturing of compound semiconductors (such as SiC and GaN).

Key Technical Features

Stable Application and Bubble Prevention: Equipped with an anti-static roller-based taping mechanism, the system ensures a smooth application process. This effectively minimizes the formation of air bubbles and prevents electrostatic damage, thereby safeguarding yields in subsequent thinning or dicing stages.

Compatibility and Temperature Control: The unit supports wafers ranging from 4 to 8 inches and is compatible with various types of tape, including blue tape and UV-curable tape. It features a heated wafer stage (typically reaching up to approximately 100°C), which facilitates secure tape adhesion—even along the edges of warped wafers.

Anti-Static Design: A comprehensive three-tier anti-static system—incorporating an anti-static stage, rollers, and an ionizer—ensures compliance with the stringent cleanliness requirements of semiconductor manufacturing.

Summary

With its compact footprint and reliable semi-automatic taping capabilities, the STK-6120 serves as a cost-effective solution for small-to-medium-sized wafer production lines, specifically for the preparatory steps of thinning and dicing.