Used ASMPT Semiconductor Electroplating System Stratus™ P500

The Stratus™ P500—offered by ASMPT (formerly NEXX)—is a 300mm electrochemical deposition (ECD) system designed for panel-level and wafer-level processing. It specializes in copper interconnect plating for advanced packaging and fan-out packaging, serving as a primary high-volume manufacturing platform in this sector.

Process Focus: The system utilizes electrodeposition to deposit metal films such as copper, nickel, and tin. Typical applications include redistribution layers (RDL) for fan-out wafer-level packaging (FOWLP), under-bump metallization (UBM), copper pillars, and through-silicon via (TSV) filling. Unlike front-end atomic layer deposition (ALD) processes, which target sub-nanometer precision, the P500 focuses on the uniformity and filling capability required for micron-scale metal interconnects.

Design Priorities: The P500 emphasizes film thickness uniformity across large-area substrates and defect-free filling of high-aspect-ratio structures. It features precision plating cells and advanced flow-field control, integrated with automated wafer/panel handling to ensure both high-volume throughput and process repeatability. The system supports both panel-level and wafer-level formats, addressing the industry's shift toward larger substrate sizes for fan-out packaging.

In short, the Stratus P500 is a mainstream high-volume manufacturing platform for copper interconnect plating in advanced packaging.