TEL Track System LITHIUS Pro DICE™ for sale

The TEL LITHIUS Pro DICE™ is a fully automated track system for 300mm (12-inch) wafers. As a specialized, process-enhanced variant within TEL’s flagship LITHIUS Pro family, it is custom-engineered to meet the unique requirements of advanced packaging and wafer-level packaging (WLP).

Core Positioning: An Expert in Handling Thick Resists and Non-Standard Wafer Topographies for Advanced Packaging

While conventional front-end track systems are designed for sub-micron thin-film resist processing, advanced packaging applications—such as RDL, bumping, and fan-out—often require the application of extremely thick photosensitive polyimide (PI) or thick-film photoresists, frequently on wafers that exhibit significant warpage. Through specialized fluid control and mechanical architecture, the LITHIUS Pro DICE is purpose-built to address these "non-standard" challenges inherent in advanced packaging.

Unique Technical Features

Application of Ultra-Thick Resists and Specialized Materials: The system features dedicated coating units optimized for high-viscosity materials, such as thick-film PI. By utilizing precise low-speed spin control and a specialized airflow design within the process chamber, it ensures exceptional film-thickness uniformity—even when applying layers tens or hundreds of microns thick—while preventing resist accumulation at the wafer edges.

Handling Highly Warped Wafers and High-Stress Substrates: Wafers used in advanced packaging—such as those with bumps or thinned, stacked configurations—are often prone to severe warpage. The DICE system incorporates optimized robotic handling and vacuum-chuck suction, preventing wafer breakage or slippage caused by mechanical stress during transport and spinning.

Superior Cleanliness and Edge Bead Removal (EBR) Control: To address the tendency for thick resists to accumulate heavily at the wafer edges, the system features an enhanced Edge Bead Removal (EBR) capability with precise solvent-dispensing control. This prevents residual resist from peeling off and causing contamination in subsequent process steps. Proprietary Process Formulation (The Significance of "DICE"): The term "DICE" alludes to the system's optimized capabilities for lithography or specialized patterning steps within the "dicing street" regions—addressing the precise exposure alignment and development requirements unique to advanced packaging production lines.

Summary

LITHIUS Pro DICE™ is a flagship system that adapts top-tier, front-end lithography and coating/development technology for the advanced packaging sector. With its exceptional ability to handle thick photoresists, specialized materials, and significantly warped wafers, it serves as an indispensable core lithography tool for 300mm wafer-level packaging (WLP) and 2.5D/3D integration production lines.