ASMPT Stratus™ P300 Wafer-Level Electrochemical Deposition (ECD/Electroplating) System

The Stratus™ P300 is a 300mm wafer-level electrochemical deposition (ECD/electroplating) system from ASMPT (formerly NEXX). As part of the Stratus electroplating platform family—which also includes the P500—the P300 is specifically targeted at wafer-level advanced packaging and back-end copper interconnects, whereas the P500 focuses more on large-format panel-level packaging.

Process Focus: The P300 utilizes electroplating to deposit metal layers such as copper, nickel, and tin. Typical applications include Under-Bump Metallization (UBM), copper pillars, Redistribution Layers (RDL), and Through-Silicon Via (TSV) filling. It is designed to achieve uniform, defect-free metal interconnects at the micron scale—a distinct process step from the atomic-level precision targeted by front-end ALD/CVD technologies.

Design Emphasis: Optimized for 300mm wafers, the system features precision plating cells and advanced flow-field control, prioritizing film thickness uniformity, the ability to fill high-aspect-ratio structures, and high repeatability for mass production. Its automated wafer handling and process recipe management are tailored for high-volume manufacturing environments, balancing throughput with process stability. Unlike the P500, which supports panel-level processing, the P300 is specialized for electroplating in standard wafer-based packaging applications.

Distinction: While both the P300 and P500 share the same Stratus electroplating technology architecture, they differ primarily in their substrate format: the P300 is designed for 300mm wafers, while the P500 supports both panel-level and wafer-level formats. Together, they address the diverse substrate requirements for copper interconnect electroplating in advanced packaging.

In short, the P300 is ASMPT’s primary production platform for 300mm wafer-level packaging electroplating; it is classified as an electroplating system rather than a thin-film deposition tool.