Disco DFM2800 Wafer Mounter for sale

The DISCO DFM2800 is a fully automatic, multifunctional wafer-mounting system designed for in-line integration with back-grinding equipment (such as the DGP8761) to process 300mm ultra-thin wafers. Its primary function is to perform the complete sequence of post-grinding processes, ranging from the application of dicing tape or Die Attach Film (DAF) to the removal of surface protective tape.

Core Focus: Engineered for Ultra-Thin Wafers

The system’s primary value lies in its ability to handle ultra-thin wafers—those measuring less than 25μm. To achieve this, it reduces the number of internal wafer transfers to just one-fifth of that required by previous models. Furthermore, cleaning mechanisms are integrated into each transfer pad and stage, minimizing the risk of wafer breakage or damage caused by handling or the embedding of microscopic dust particles.

Efficiency and Compatibility

Through optimized transport mechanisms, the DFM2800 delivers a maximum throughput during continuous operation that is approximately 50% higher than its predecessor, the DFM2700. It supports the use of DAF-integrated dicing tape—essential for System-in-Package (SiP) manufacturing—and offers optional features such as pre-cutting and ID recognition.

Key Specifications

The system supports Φ200/Φ300 mm wafers, with a mounting accuracy of ≤ ±0.5mm in the X/Y axes and ≤ ±0.5° in the θ (rotational) axis. It measures approximately 2,150 × 2,643 × 1,800 mm and weighs about 3,100 kg.