Used SUSS MicroTec ACS200 Track System

The SUSS MicroTec ACS200 (typically referring to the ACS200 Gen3 platform) is a fully automated coater and developer system—a "track" processing tool used in photolithography—designed for both R&D and high-volume manufacturing of 100mm to 200mm wafers.

Core Positioning

The system utilizes a modular cluster architecture, integrating process modules such as spin-coating, hot-plate baking, and developing. A central robotic handler automatically transfers wafers between these modules. Balancing the flexibility required for R&D with the high throughput needed for mass production, the system primarily serves sectors including advanced packaging (RDL, bumping), MEMS, and compound semiconductors.

Key Technical Features

GYRSET® Coating Technology: This proprietary closed-cover coating mode creates a low-turbulence, solvent-rich environment above the wafer surface. It significantly enhances the uniformity and stability of thick-resist processes while minimizing interference from external environmental factors.

Broad Process Coverage: The system supports photoresists with viscosities ranging from <100 cP to <20,000 cP, and film thicknesses from <100 nm (thin resists) to <250 µm (thick resists, including passivation layers). It is compatible with both TMAH-based and solvent-based developers.

Flexible, Scalable Architecture: Available in 3M, 5M, or 6M platform configurations with 2 or 4 I/O ports, the system allows for field upgrades to accommodate varying production capacity requirements.

Handling of Challenging Wafers: Specialized chucks and transport mechanisms are designed to handle warped, ultra-thin, or stacked wafers, all while meeting ESD (electrostatic discharge) protection standards.

Summary

The ACS200 is SUSS MicroTec’s primary automated platform for photolithography coating and developing on wafers 200mm in size and smaller. With its GYRSET thick-resist processing capabilities and modular flexibility, it serves as a core piece of equipment for photoresist handling in advanced packaging and MEMS production lines.