Used PVA Tepla IoN 40 Plasma Cleaner

The PVA TePla IoN 40 is a fully automated, in-line atmospheric-pressure plasma cleaning system designed for continuous high-volume production in sectors such as advanced semiconductor packaging, electronic assembly, and automotive electronics.

Core Positioning: Atmospheric-Pressure In-Line Processing

Unlike traditional vacuum plasma systems, the IoN 40 utilizes atmospheric-pressure plasma technology combined with an in-line conveyor architecture. It eliminates the need for costly vacuum chambers and pumping systems, allowing for direct integration into a customer’s automated production line. This enables continuous cleaning and activation of substrates and lead frames during transport, significantly increasing throughput.

Key Processes and Features

Uniform Atmospheric-Pressure Processing: Through optimized nozzle design and precise gas flow control, the system generates a high-density, uniform plasma in an open environment, ensuring consistent cleaning and activation across the surfaces of the workpieces.

Flexible and Gentle Processing: The system is compatible with various process gases (such as Ar, O₂, N₂, etc.) and is particularly effective at removing organic contaminants, increasing surface energy, and improving adhesion for bonding or encapsulation. By operating at atmospheric pressure, it avoids the physical stress that vacuum evacuation can exert on sensitive components.

High-Level Automated Integration: The system supports seamless interfacing with upstream and downstream conveyor tracks. It features comprehensive communication protocols (SMEMA/SECS/GEM) and can be integrated directly into a factory’s Manufacturing Execution System (MES), meeting the requirements of high-standard automated production.

Summary

With its efficient atmospheric-pressure in-line processing and high degree of automation, the IoN 40 serves as an ideal dry-cleaning solution for enhancing yields and throughput in advanced packaging and electronic assembly lines—making it especially well-suited for high-volume production scenarios that involve vacuum-sensitive components or require high processing speeds.