Used TEL WDF™ 12DP+ Fully Automatic Dicing Probe Station

The TEL WDF™ 12DP+ is a fully automated prober designed for wafers mounted on dicing frames. Its primary purpose is to perform electrical testing on chips—either on full wafers or on dicing frames—following the dicing (singulation) process but prior to final packaging, in order to identify Known Good Die (KGD). It addresses a key limitation of conventional wafer probers, which are typically unable to handle wafers already mounted on dicing frames.

Key Selling Point: Dual-Format Compatibility Without Kit Changes

The most notable design feature of the WDF 12DP+ is its ability to process both standard 300mm wafers and 300mm dicing frames without requiring a change of hardware kits. This allows a single machine to handle both conventional wafer-level testing and the testing of diced wafers on frames, eliminating the downtime otherwise required to swap kits when switching between input formats. An optional 8-inch (200mm) conversion kit is also available for processing 200mm dicing frames.

Key Specifications

According to official TEL product documentation, the system offers an XY probing accuracy of ±1.8 μm and a Z-axis accuracy of ±5.0 μm, with a standard probing force of 200 kg (upgradable to 300 kg). The platform utilizes a linear motor architecture, incorporates an ASU/BCU-II optical system, and runs on an operating system based on Windows and PLC.

Alignment and KGD Capabilities

The system features TEL’s proprietary "N-Shot" alignment algorithm, which enables high-precision, multi-point measurement both before and after the dicing process. This capability is particularly critical for advanced packaging technologies such as WLCSP (Wafer-Level Chip Scale Packaging) and Fan-Out packaging. By conducting electrical tests immediately after dicing/singulation, defects—which might otherwise only be detected during final package testing—can be identified early, thereby safeguarding the overall yield of multi-chip packages. Furthermore, the WDF 12DP+ offers enhanced ESD (electrostatic discharge) protection and superior cleanliness standards.

Strategic Positioning

The WDF 12DP+ is not a general-purpose wafer prober; it is specifically engineered to meet the requirements for KGD screening of wafers mounted on dicing frames following the dicing process. For production lines involving ultra-thin wafers, Fan-Out, panel-level packaging, or processes requiring electrical verification immediately after dicing, this equipment fills the gap between wafer probers and final test. If the requirement is limited to conventional 300mm wafer-level testing, the standard Precio series is sufficient, and the advanced handling capabilities of the WDF 12DP+ framework would go underutilized.