Used TEL Prexa™ SDP probe station for sale

The TEL Prexa™ SDP is a prober designed specifically for testing singulated devices (individual chips after dicing), rather than for traditional wafer-level probing. Its primary function is to identify Known Good Dies (KGD) from singulated bare dies prior to 2.5D/3D advanced packaging, thereby ensuring high final yields for multi-chip packages.

Why is it needed?

Traditional probers handle entire wafers. However, AI and HPC (High-Performance Computing) chips increasingly utilize chiplet architectures, where multiple bare dies are integrated into a single package; a single defective die can render the entire, high-value package unusable. Consequently, it is essential to perform electrical testing and screening on individual, singulated chips before they are packaged. The Prexa SDP was developed for this purpose, leveraging TEL’s expertise in high-precision contact, material handling, and probe-mark inspection—adapted from wafer-level probing to the handling of individual chips.

Key Differentiator: Thermal Control for High-Heat Chips

During testing, AI/HPC bare dies often exhibit high power consumption and generate significant heat. Without precise thermal management, test results become unreliable. The Prexa SDP features a proprietary, high-performance thermal control head developed by TEL. This system enables high-precision active temperature control, allowing it to effectively manage high-power chips and ensure the accuracy of both chip handling and KGD classification—a capability that sets it apart from standard probers.

Key Specifications (Based on Industry Media Reports)

The system supports chip sizes ranging from 2×2 mm to 100×100 mm, with an XY-axis probing accuracy of ±1.5 μm and a Z-axis accuracy of ±2.5 μm. It utilizes a linear motor-driven platform and can withstand a load of up to 500 kg during testing. (These specifications are cited from the South Korean media outlet *THE ELEC*; they have not been itemized in official press releases from TEL.)

Ecosystem Integration

Teradyne has partnered with TEL to integrate the Prexa SDP with its UltraFLEXplus test system, creating a comprehensive solution for high-volume KGD screening of individual chips. In short, Prexa SDP is a product of TEL adapting its wafer prober technology for use at the individual-chip level. Its core selling point is its temperature control capability, and it targets the increasingly critical process of KGD (Known Good Die) screening—a step that takes place prior to advanced packaging.