Used TEL Probe Station Cellcia™

TEL Cellcia™ is not a conventional wafer prober; rather, it is a multi-unit parallel testing platform designed for 300mm wafers. Moving beyond the traditional approach of simply increasing the speed of an individual prober, Cellcia utilizes multiple independent test units that operate concurrently to reduce the total turnaround time for an entire batch of wafers.

Architecture and Throughput Logic

The most distinctive feature of Cellcia is its multi-section, multi-layer architecture. The system can be configured with 12 or 25 independent test units, each capable of processing wafers simultaneously. By distributing a batch of wafers across these units for parallel testing, the time required to complete the entire batch is significantly shortened. This stacked, multi-layer design also drastically reduces the equipment's footprint, resulting in a much higher throughput per unit area compared to traditional wafer probers.

Core Specifications

The system supports 300mm wafers, features an XY probing accuracy of ±5.0 μm, and supports a maximum probing force of 200 kg. It employs a vacuum-contact chuck, utilizes an ASU/BCU-II optical system, and runs on an operating system based on Windows and PLC. Its primary applications include memory testing and wafer-level burn-in.

In short, Cellcia is a 300mm memory wafer testing platform that leverages a parallel architecture to boost throughput. Its value lies not in pushing the limits of single-point precision, but in minimizing the total test time for an entire batch through the simultaneous operation of multiple test units.