Used Nitto DR8500III

The Nitto DR8500III is a fully automated protective tape application system for 200mm wafers, part of the Nitto Denko "NEL SYSTEM" series. It is specifically designed for the back-grinding process, applying protective tape to the patterned side of a wafer to prevent damage during grinding.

Core Specifications

The system supports 8-inch, 6-inch, and 5-inch wafers, with an optional configuration for 4-inch wafers. It offers a standard throughput of 77 wafers per hour, while the low-tension version (RF series) achieves 68 wafers per hour. It is designed for wafers that have not yet undergone back-grinding (i.e., wafers at their original, pre-grinding thickness).

Key Features

This model specializes in low-tension tape application (the RF version), which minimizes stress on the wafer surface during the process. It also offers optional heating for the stage or rollers to accommodate the specific requirements of various tape technologies. The system features a touchscreen interface, complies with CE marking standards, and supports the integration of the SECS/GEM communication protocol for connectivity with factory automation systems.

Market Positioning

The DR8500III is a mature, high-volume production tool designed for wafer lines of 200mm or smaller. It strikes an optimal balance between application precision and processing efficiency, making it well-suited for the protective tape application step—a critical precursor to wafer thinning—in the production of logic, memory, and power devices.