Used Nitto Wafer Mounter DSA840II

The Nitto DSA840II is a semi-automatic wafer protective tape applicator designed for the back-grinding process. It applies a protective tape to the patterned side of a wafer to prevent damage to the devices during the grinding operation.

Key Features

Wafer Compatibility: A single stage accommodates 8, 6, 5, and 4-inch wafers, suitable for standard-thickness wafers prior to back-grinding.

Operation: A semi-automatic system where wafers are loaded and unloaded manually, while the processes of tape application, cutting, and waste tape removal are performed automatically.

Efficiency and Precision: The application cycle is approximately 50 seconds per wafer, with a positioning accuracy of ±0.3 mm.

Process Control: Equipped with a touch-panel interface, the system supports low-tension application and stress control, and includes a feature for detecting tape sag.

The equipment complies with CE marking and SEMI S2/S8 safety standards, making it well-suited for pre-grinding protection in production lines handling small-to-medium-sized wafers.