SINTAIKE STK-7120 Fully Automatic Wafer Taping Machine

The SINTAIKE STK-7120 is a fully automated wafer-taping machine designed for 12-inch (300mm) wafers, specifically engineered for the pre-thinning and pre-dicing stages in advanced packaging and wafer manufacturing.

Core Positioning: Fully Automated, Large-Format Mass Production

As a high-end model in the 7000 series, the STK-7120 comes standard with 300mm wafer handling capabilities. It integrates fully automated robotic loading and unloading, as well as automatic taping and tape-cutting functions. Designed for seamless integration with FOUPs (Front Opening Unified Pods), it can be incorporated directly into high-standard automated mass-production lines, significantly enhancing wafer throughput and batch-to-batch consistency.

Key Technical Features

High-Precision, Large-Format Lamination: To address the susceptibility of 300mm wafers to warpage, the system utilizes high-precision anti-static rollers and optimized tension control. This ensures a smooth, uniform application of the tape, effectively minimizing air bubbles and edge delamination.

Thermal and Anti-Static Systems: The machine features heated stages and cutting blades to improve tape adhesion at the wafer edges. It also incorporates multiple anti-static measures—including built-in ionizers and anti-static rollers—to ensure a high-cleanliness processing environment.

Broad Material Compatibility: The system supports a wide range of materials, including UV-curable tapes, DAF (Die Attach Film), and various blue tapes, accommodating the diverse process requirements of silicon, compound semiconductors, and advanced packaging (such as Fan-Out technology).

Summary

With its fully automated, large-format handling capabilities and highly stable lamination technology, the STK-7120 serves as a core piece of equipment for 300mm wafer production lines, helping to boost yields and production capacity during pre-thinning and pre-dicing processes.