TEL ACT™12 SOD Track System for sale

Short Description:

The TEL ACT™12 SOD is a fully automated track system designed for 300mm (12-inch) wafers

Product Detail

TEL Track System ACT™12 SODThe TEL ACT™12 SOD is a fully automated track system designed for 300mm (12-inch) wafers, based on TEL’s classic ACT 12 platform. The "SOD" designation indicates that it is equipped with a module for the application of Spin-on Dielectrics (SOD).

Core Positioning: An Integrated Platform for Advanced Lithography Processing and SOD

This system integrates standard photolithography processes—such as photoresist coating, baking, and developing—with the application and curing processes for SOD materials (e.g., Spin-on Glass (SOG) or spin-on low-k dielectric materials). It is primarily utilized in the production lines for advanced logic devices, memory components, and advanced packaging, meeting the requirements for high throughput and stringent cleanliness in mass production.

Key Technical Features

SOD Process Integration: Equipped with dedicated SOD coating chambers and baking/curing units, the system enables the spin-coating of insulating dielectrics or planarization materials on a single platform. Precise control over fluid flow rates and rotational speeds ensures high uniformity in film thickness.

High-Precision Lithography Support: Features high-precision temperature-controlled hotplates and developing units, ensuring consistent critical dimension (CD) uniformity during photoresist coating and development—essential for advanced-node lithography processes.

High Throughput and Automation: Utilizing a compact cluster architecture, the system supports automated FOUP loading/unloading and high-speed robotic wafer handling. It includes comprehensive SECS/GEM communication capabilities, allowing for seamless integration into 300mm automated mass-production lines.

Summary

By combining standard lithography track processes with Spin-on Dielectric (SOD) technology, the ACT™12 SOD serves as a critical processing platform for 300mm advanced-node manufacturing and advanced packaging, offering high integration, superior throughput, and excellent control over film uniformity.

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