TEL MARK 8 Fully Automated Coating and Developing Track System

The TEL MARK 8 is a fully automated track system designed specifically for 200 mm (8-inch) wafers. As a member of TEL’s classic MARK series, it serves as a core piece of equipment for photolithography processes in the 8-inch wafer era.

Core Positioning: A Highly Reliable Hub for Photolithography

This system handles the automated processing of wafers before and after exposure in lithography tools (steppers/scanners), encompassing steps such as photoresist spin-coating, soft-baking, post-exposure baking (PEB), developing, and curing. It is primarily utilized in production lines for mature-node processes, power semiconductors, analog chips, and micro-electromechanical systems (MEMS), and is renowned for its high stability and process consistency.

Key Technical Features

Modular Cluster Architecture: The system integrates various process units—including spin-coating, hot plates, cooling stations, and developing modules—which can be configured flexibly based on production capacity requirements. A central robotic arm manages high-speed wafer transport, ensuring high throughput and superior equipment uptime.

Precise Temperature and Fluid Control: Multi-zone, independently controlled hot plates ensure uniform baking, while precise control over spin-coating speeds and developer flow rates guarantees consistency in photoresist thickness and critical dimensions (CD) across different batches.

Seamless Production Line Integration: An integrated micro-environment control system effectively prevents particle contamination. The system supports automated loading and unloading of standard wafer cassettes and features SECS/GEM communication capabilities, allowing for seamless integration with various lithography tools and automated high-volume production lines.

Summary: With its mature and stable coating/developing processes, flexible modular architecture, and exceptional automation integration capabilities, the TEL MARK 8 has become a critical asset for ensuring high lithography yields in 200 mm mature-node and specialty process production lines.