Used TEL ACT™12 Fully Automated Lithography Track System

Short Description:

The TEL ACT™12 is a fully automated track system designed for 300mm (12-inch) wafers

Product Detail

TEL Track System ACT™12The TEL ACT™12 is a fully automated track system designed for 300mm (12-inch) wafers, serving as a core lithography-support platform from Tokyo Electron (TEL) for the 300mm era.

Core Positioning: An Automated Hub for Lithography Processes

In the semiconductor lithography workflow, the ACT 12 handles all chemical and thermal processing steps for wafers—both before and after they enter the lithography tool (scanner/stepper). It integrates modules such as photoresist spin-coating, soft baking, post-exposure baking (PEB), developing, and hard baking. Through a central robotic handler, it interfaces seamlessly with the lithography tool, enabling a fully automated, continuous production flow.

Key Technical Features

Modular Cluster Architecture: The system consists of various process units (coating, hot plates, cooling, and developing) along with interface units. The number of modules can be flexibly configured to meet specific capacity requirements, ensuring high throughput.

High-Precision Temperature and Fluid Control: Hot plate units utilize multi-zone precision temperature control to ensure uniform baking of the photoresist. Coating and developing units employ precise control over rotational speeds and chemical flow rates, guaranteeing consistent critical dimensions (CD) and exceptionally low defect rates.

High Cleanliness and Automation: The system features an advanced built-in "mini-environment" to prevent particle contamination. It comes standard with FOUP (Front Opening Unified Pod) loading/unloading capabilities and supports SECS/GEM communication, allowing for seamless integration into fully automated 300mm production lines.

Summary

The ACT™12 is an indispensable piece of lithography-support equipment for 300mm production lines—covering advanced logic, memory, and specialty processes. With its high throughput, superior process stability, and excellent integration capabilities, it ensures both high yield and high efficiency within the lithography stage.

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