Accretech TSK W-GM-5200 for sale

The Accretech W-GM-5200 is a fully automated, dual-spindle wafer grinding system designed for high-volume backside thinning of 300mm wafers. It represents a high-end production model within the W-GM series.

Key Features

Efficient Dual-Spindle Grinding: Equipped with separate spindles for rough and fine grinding, the system performs the entire thinning process within a single chamber—eliminating the need for wafer transfer—thereby ensuring high throughput while maintaining a low breakage rate.

High-Precision Thickness Control: Utilizing in-line thickness measurement combined with non-contact sensors, the system achieves precise control over the grinding endpoint. This ensures excellent Total Thickness Variation (TTV) and surface roughness, meeting the stringent requirements for ultra-thin wafers in advanced packaging applications.

Full Automation Integration: The system comes standard with FOUP handling and automated loading/unloading, an integrated cleaning unit, and support for SECS/GEM communication. It integrates seamlessly into 300mm automated production lines and includes monitoring and early-warning functions for grinding wheel lifespan.

Process Compatibility: Suitable for silicon, compound semiconductors (such as SiC and GaN), and hard, brittle materials; it also supports the TAIKO thinning process (optional).

Summary

The W-GM-5200 strikes an optimal balance between dual-spindle grinding efficiency, processing precision, and automation stability. It serves as a core production tool for high-throughput, high-yield backside thinning in 300mm wafer manufacturing and advanced packaging lines.