SINTAIKE Wafer Mounter STK-6020 for sale

The SINTAIKE STK-6020 is a desktop, semi-automatic wafer-taping machine designed for applying protective tape to the back side of 4- to 8-inch wafers prior to back-grinding. It offers an excellent balance of cost-effectiveness and operational flexibility, making it well-suited for small-to-medium-batch production and R&D environments.

Core Process and Efficiency

The system utilizes an anti-static roller-based lamination process, automating the tape-pulling and application steps, while manual intervention is required only for loading and unloading wafers. It ensures consistent taping quality, with a nominal wafer yield of ≥99.9% and a bubble-free finish (excluding defects caused by dust particles). The machine achieves a throughput of ≥80 wafers per hour, with a product changeover time of ≤5 minutes, facilitating rapid switching between different wafer specifications.

Anti-Static and Temperature Control Design

To meet the stringent cleanliness requirements for pre-grinding taping, the STK-6020 incorporates a triple-layer anti-static system: a Teflon-coated wafer chuck, anti-static lamination rollers, and an ionizing static eliminator—addressing static electricity on wafer surfaces, tape interfaces, and the surrounding air. Both the wafer chuck (heatable up to 100°C) and the cutting blade (heatable up to 120°C) are temperature-controlled, ensuring superior tape adhesion, even along the edges of warped wafers.

Applications

The equipment supports various materials, including silicon and gallium arsenide (GaAs), and is compatible with both blue tape and UV-curable tape. Its semi-automatic design focuses automation on the critical lamination and cutting stages—the primary determinants of quality—while leaving wafer loading and unloading to operators. This approach reduces both equipment costs and the required footprint, making it an ideal choice for compound semiconductor production lines or process R&D and validation.