Used DISCO DMM9200 Fully Automatic MUSUBI Wafer Taping Machine

The DISCO DMM9200 is a fully automated "MUSUBI" wafer-taping system. As the successor to the DFM2800, it is specifically designed for frame-taping and protective film removal for ultra-thin wafers (under 15μm).

Core Focus: Stable Handling of Ultra-Thin Wafers

The system features enhanced in-tool cleaning capabilities, which effectively prevent wafer breakage caused by trapped particles, ensuring the integrity of ultra-thin wafers during transport and the taping process.

Efficiency Gains and MUSUBI Compatibility

By optimizing the supply path for dicing tape, the DMM9200 reduces tape-changeover time by 85% (compared to previous DISCO models). Furthermore, it supports the "MUSUBI" cluster system, allowing for integration with equipment such as grinders and polishers. This enables a fully automated workflow—encompassing UV irradiation, inspection, taping, and protective film removal—thereby minimizing the risk of wafer breakage and increasing production capacity.

Key Specifications

Supports Φ200/Φ300 mm wafers; frame-taping accuracy is ≤ ±0.5mm in the X/Y axes and ≤ ±0.5° in the θ (rotational) axis; tape-application accuracy is ≤ ±1.0mm in the X/Y axes. The system measures approximately 2,150 × 3,450 × 1,800 mm and weighs about 3,350 kg.