Used SINTAIKE STK-6050

The SINTAIKE STK-6050 is a floor-standing, semi-automatic wafer-taping machine (used for wafer thinning preparation). Positioned above the STK-6020 (a tabletop model) that you previously inquired about, it offers enhancements in throughput, automation, and supported wafer sizes.

Core Positioning and Operation

Designed for 4- to 8-inch wafers, this machine applies protective tape to the wafer surface prior to backside grinding. It utilizes a semi-automatic workflow—featuring manual wafer loading/unloading combined with automated taping and cutting—to increase automation in critical process steps while keeping costs controlled.

Key Performance and Process Capabilities

Throughput and Efficiency: Capable of processing ≥75 wafers per hour, with a taping cycle time of ≤45 seconds (excluding loading/unloading) and a changeover time of ≤10 minutes.

Taping Quality: Employs anti-static rollers for tape application, achieving a nominal wafer yield of ≥99.9% with no air bubbles (excluding those caused by dust particles).

Compatibility: Supports various materials, including silicon, gallium arsenide (GaAs), and silicon carbide (SiC), and is compatible with both blue tape and UV-curable tape.

Key Differences from the STK-6020

The STK-6050 is a floor-standing unit, whereas the STK-6020 is a tabletop model. The STK-6050 features a more robust structure, supports a wider range of wafer sizes (4–8 inches), and includes heating capabilities for both the chuck (stage) and the cutting blade. It is better suited for production lines or R&D environments that require higher stability and continuous operation.

Anti-Static and Temperature Control

The system incorporates the brand’s signature triple anti-static design: a Teflon-coated chuck, anti-static rollers, and an ionizing fan for static neutralization. Both the chuck and the cutting blade are heatable (the chuck up to approximately 100–120°C, and the blade up to 120°C), which facilitates superior tape adhesion, even on warped wafers.