ASM EAGLE Xtreme GoCu High-Speed ​​Fully Automatic Wire Bonder

The ASM EAGLE Xtreme GoCu is a high-speed, fully automatic wire bonder from ASMPT’s EAGLE Xtreme series. It is designed as a mass-production platform for ball and wedge bonding—using either copper or gold wire—in high-density, fine-pitch packaging applications. The "GoCu" suffix indicates that the model is specifically optimized for copper wire processes, leveraging the cost and electrical performance advantages of copper interconnects.

Core Process and Precision

The system utilizes thermosonic bonding and supports various modes, including gold ball bonding and wedge bonding. According to performance data from Xiamen University, the machine offers a bonding precision of ±2 μm (X/Y-axis), a bonding speed of up to 25 wires per second (at a 2 mm wire length), and a maximum wire length of 9 mm. It accommodates substrates up to 300 mm × 100 mm in size. The bonding force is adjustable between 10 and 250 gf, and the gold ball size can be configured within a range of 50–110 μm.

Process Flexibility and Control

The EAGLE Xtreme series is renowned for its process flexibility, supporting a wide range of wire-loop profiles and thermal profiles, and is compatible with various wire materials, including aluminum and copper. The equipment features a high-precision XYZ motion control system and a vision-based alignment system, allowing operators to quickly program bond-point locations. The GoCu version further enhances process window control for copper wire bonding, making it well-suited for integrated circuit (IC) packaging that demands high interconnect density and superior electrical performance.

Market Positioning

In the secondary market, this model is typically found in units manufactured between 2013 and 2016; most EAGLE Xtreme GoCu machines currently available are either used or refurbished. As a mass-production bonding platform, its primary selling points are its high-speed wire-bonding capability and its specialized optimization for copper wire processes, serving as a key solution for wire interconnection in medium- to high-volume packaging production lines.