K&S 1474FP Wedge Bonder for sale

The K&S 1474FP is a wedge bonder from the classic 1474 series by Kulicke & Soffa (K&S), designed primarily for ultrasonic wedge bonding with aluminum and gold wires.

Core Positioning and Process Capabilities

Introduced by K&S in the mid-1990s, this model serves as an upgrade to the earlier 1472 wedge bonder, offering enhanced capabilities for higher pin counts and finer pitch requirements, along with faster bonding speeds. It supports a variety of wire materials—including gold, palladium, aluminum, titanium, and copper—with diameters ranging from 0.2 mm to 2.0 mm (approximately 8 to 80 mils), accommodating diverse pitch and bond length specifications.

Key Features

The system incorporates a self-aligning mechanism and an integrated vacuum unit to facilitate rapid setup and workpiece handling. It features a 6-inch LCD touchscreen interface and built-in diagnostic functions. The heating system offers high-speed response and supports customizable temperature profiles; combined with electronic pressure control, this ensures high repeatability throughout the bonding process. Its robust steel-frame construction provides consistent process stability across production batches.

Summary

As a classic wedge-bonding solution, the 1474FP is well-suited for applications involving power devices, logic devices, and SOIC packages. Thanks to its broad wire-diameter compatibility and stable thermal control, it remains a practical choice for specific packaging requirements. Most 1474FP units currently available on the market are pre-owned (second-hand) equipment.