K&S 4523 manual wedge bonder for sale

The K&S 4523 is a manual wedge bonder that utilizes the wedge bonding process. It is designed for the ultrasonic bonding of aluminum and gold wires, with a particular focus on deep-access bonding and the packaging of microwave devices.

Core Process and Technical Specifications

The system supports the bonding of gold wires (12.7–76 µm) and aluminum wires (20–76 µm), with an option for gold ribbon (up to 25×250 µm). It features an ultrasonic power range of 1.3–2.5 W, a bonding time of 10–1000 ms, and a bonding force of 10–160 g. Additionally, it is equipped with a heated work stage capable of reaching temperatures up to 250°C. The device offers a bonding area of 134 mm × 134 mm and incorporates a 60 kHz ultrasonic transducer.

Positioning and Key Features

As a manual system, it requires the operator to align the bonding points by hand, though the bonding cycle itself can be executed semi-automatically. Its most notable advantage is its "deep-access" capability, which enables interconnections to be made deep within cavities—a critical requirement for microwave devices, hybrid integrated assemblies, and chip-on-board (COB) packaging. In research environments (such as laboratories at the University of Oxford), this equipment is frequently used for ultrasonic aluminum wire bonding, supporting wire diameters ranging from 18 to 100 µm.

Summary

The K&S 4523 is a manual wedge bonder tailored for research and development, as well as specialized packaging applications. Its primary value lies in its exceptional deep-access bonding capability and broad compatibility with both gold and aluminum wires, making it a highly practical tool for laboratories focused on microwave and optoelectronic packaging.