K&S ATPremier LITE™ Wafer Level Bonder for sale

The K&S ATPremier LITE™ is not a traditional wire bonder; rather, it is a wafer-level stud bumping system designed for creating bumps in wafer-level packaging.

Core Positioning

Built on the K&S "Force" series platform and inheriting the performance capabilities of the ATPremier PLUS™, the ATPremier LITE™ is positioned as a more cost-effective, entry-level solution. It was first unveiled at SEMICON China in 2019 and is officially classified as a "wafer-level stud bumping system" or "wafer-level bonder."

Key Specifications

Processing Capability: Supports wafers, ceramic substrates, or other substrates up to 200 mm in size; an optional 4-inch dual-station worktable is available to increase throughput.

Precision: Offers a stud bumping placement accuracy of ±3.5 µm @ 3σ on 200 mm workpieces.

Process: Features industry-leading low-temperature gold stud bumping capabilities, with optional kits available for copper or silver-alloy wire.

Automation: Supports integration with automated wafer handling systems or an EFEM (Equipment Front End Module) to enable full factory automation.

Target Applications

Typical applications include wafer-level stud bumping for devices such as MEMS, SAW filters, and CMOS image sensors. If you are looking for a traditional wire bonder from K&S, the ATPremier LITE™ does not fall into that category.