Used ASM Wire Bonder iHawk-V

The iHawk-V is a fully automated wire bonder from ASM (ASM Pacific Technology), serving as a core piece of equipment in the back-end packaging interconnection process. It differs from the die bonder you previously inquired about: while a die bonder places the chip onto a substrate, a wire bonder creates electrical connections between the chip’s bond pads and the substrate or external pins using metal wires.

Core Positioning: The iHawk-V is designed as a high-precision, high-throughput automated wire bonding platform. It supports a variety of wire materials—such as gold, aluminum, copper, and Kovar—and accommodates a wide range of wire diameters and loop profiles. Its dual-mode drive system and self-adjusting control loops are engineered to balance high-speed operation with precise bonding accuracy.

Technical Features: The system is equipped with a PC-based machine vision suite used for alignment and post-bonding physical defect inspection. The control system integrates digital servos and CNC modules, capable of storing up to 6,000 product recipes, with an optional remote monitoring and diagnostic feature (iHawk Connect). It utilizes a touchscreen interface that supports both manual debugging and fully automated mass production.

Contextual Distinction: As a wire bonder, the iHawk-V operates within the same back-end interconnection segment as equipment from manufacturers like Palomar or HYBOND. However, this ASM series emphasizes versatility for both ball bonding and wedge bonding within automated, high-volume production environments. It represents a different stage in the packaging assembly line compared to the ASM die bonders you previously asked about (such as the AD or Photon series); together, these systems form the "die attach—interconnection" equipment suite for back-end manufacturing.