Used Palomar 9000 wedge bonding machine and ribbon bonding machine

The Palomar 9000 is a high-speed fine-wire wedge bonder and ribbon bonder from Palomar Technologies. It is designed for the wire bonding stage of back-end semiconductor packaging—distinct from die-attach or thin-film deposition equipment. Introduced in 2015, the system targets applications in optoelectronics, RF/microwave, and complex hybrid circuit packaging.

Core Process Capabilities: The 9000 specializes in wedge bonding, supporting gold wire, aluminum wire, and ribbon materials. It accommodates both thermosonic and ambient-temperature bonding processes, making it well-suited for high-mix packaging environments. Typical applications include RF and microwave devices, optical transceivers, high-power hybrid circuits, MCM power interconnections, fine-pitch components, and "running stitch" die-to-die interconnects. In advanced photonics packaging, it is frequently used for wedge bonding within deep cavities or constrained-wall enclosures.

Key Technical Features: The system utilizes a voice-coil-driven bond head for precise force control. Combined with auto-focus and automated height-learning capabilities, it enables non-contact surface approach. The bond head is mounted on a theta axis, which ensures superior wire tension control and a shorter wire-feed path. It offers a single working area of 304 × 152 mm and supports interchangeable deep-access wedge clamps (available in 45–60° and 90° configurations). Both round wire and ribbon can be processed using the same clamp, eliminating the need to swap out the bond head. The system achieves bonding speeds of up to 7 wires per second with a precision of 1 μm (3 sigma).

Software and Automation: The equipment features Palomar’s proprietary i2Gi® graphical interface, which enables real-time bond monitoring and process verification, while the Bond Data Miner™ software provides centralized data management and yield analysis. Optional in-line conveyor systems and automated loading/unloading modules are available, facilitating integration into fully automated production lines. In short, the Palomar 9000 is a high-precision wedge bonding platform designed for the mass production of optoelectronic and RF/microwave packages. It belongs to a different stage of the packaging interconnection process than the die bonder you were previously looking at: die bonding handles the placement of the chip, while wedge bonding establishes the electrical connections.