Used Besi Compact Line - P

The Besi Fico Compact Line - P (FCL-P) is a trim-and-form system specifically designed for power semiconductor products, engineered to meet stringent requirements for high precision, high Cpk, and product traceability.

The system features a 50 kN press force and incorporates an advanced contamination control system; each press is equipped with an independent suction unit and a cyclonic dust filter, enabling the trouble-free processing of pre-plated and interdigitated (comb-style) lead frames. The equipment supports a production rate of up to 250 strokes per minute and accommodates lead frames ranging from 150–300 mm in length, 18–125 mm in width, and 0.1–2 mm in thickness. Its modular architecture allows for flexible integration of components such as dual-stack magazine handlers, vision inspection systems, laser marking units, and gravity-fed tube unloaders. The short, controlled transport path enhances performance while preventing damage to the products.