Used TSK ChaMP211 CMP System

The TSK (Accretech) ChaMP 211 is a fully automated chemical mechanical polishing (CMP) system designed for wafers 200mm (8 inches) in diameter or smaller. It serves as a classic, high-volume production platform from Accretech, tailored for mature manufacturing nodes and specialized process technologies.

Core Positioning: A Compact and Efficient Standalone CMP System

This system integrates polishing, endpoint detection, and post-CMP cleaning into a single, unified platform. It is primarily designed to provide high-precision global planarization for compound semiconductors (such as SiC and GaAs), power semiconductors, MEMS, and silicon-based optoelectronic devices.

Key Technical Features

High-Rigidity Zonal Pressure Control: Featuring a precision-engineered polishing head, the system supports independent pressure control across multiple zones. This effectively mitigates the "dishing" effect at wafer edges and significantly improves within-wafer thickness uniformity (TTV), meeting the rigorous thinning and planarization requirements for hard, brittle materials.

Integrated In-line Cleaning: The system incorporates high-efficiency brush-cleaning and spin-drying modules, enabling immediate post-polishing cleaning to prevent slurry residue and particle re-adhesion.

Precise Endpoint Detection: Equipped with optical or eddy-current-based film thickness monitoring systems, the platform ensures accurate termination of the polishing process, thereby minimizing yield loss caused by over-polishing or under-polishing.

Summary

With its compact footprint, stable zonal pressure control, and comprehensive integrated cleaning capabilities, the ChaMP 211 stands out as an ideal CMP production solution for 200mm (and smaller) wafer lines, offering an optimal balance between process precision and total cost of ownership.