Used PVA TePla TECHNICS 660

The PVA TePla TECHNICS 660 is a medium-to-large-volume plasma etching and surface treatment system designed for high-volume production and advanced R&D in the semiconductor packaging, microelectronics, and MEMS industries. The "660" in its model name typically indicates that it features a vacuum chamber capable of accommodating larger batches or larger workpieces.

Core Focus: High-Volume Batch Processing

Unlike smaller R&D systems, the TECHNICS 660 emphasizes batch processing capabilities. It can process more wafers, strips, or substrates in a single cycle, effectively increasing production line throughput. It is ideal for mass production environments with high capacity requirements and demanding fine plasma processes.

Key Technical Features

Large Chamber and Excellent Uniformity: The spacious vacuum chamber, combined with optimized gas distribution and electrode design, ensures highly uniform plasma distribution when processing large batches of workpieces, guaranteeing process consistency within and between batches.

Dual Modes and Wide Process Scope: Supports direct and downstream plasma modes, compatible with various process gases such as O₂, Ar, CF₄, and SF₆. It can perform efficient ashing, precision surface activation, organic matter removal, and isotropic etching.

High reliability and automation: The vacuum system and temperature control module are optimized for mass production environments. It features comprehensive corrosion protection and safety interlocks, and can be integrated with automated loading and unloading systems to meet the integration requirements of high-standard mass production lines.

In summary, the TECHNICS 660, with its spacious chamber providing high throughput, stable process uniformity, and flexible plasma handling capabilities, has become a core piece of equipment for improving capacity and yield in packaging, MEMS, and specialty process production lines.