asm ad830

The ASM AD830 (including the upgraded AD830 Plus) is a fully automatic die bonder from ASMPT, designed for the high-precision placement of semiconductor dies onto substrates or lead frames during the packaging process. Its core strength lies in balancing high speed with high precision: the AD830 Plus achieves an output of up to 22,000 units per hour, with an alignment accuracy of approximately ±25.4μm, and supports die sizes ranging from 0.15mm to 5.08mm. The system utilizes a linear-motor-driven bonding head and a rotary bonding arm to enhance efficiency, and it is equipped with an image recognition system that facilitates both pre- and post-bonding inspection. This model is well-suited for the mass production of components such as LEDs, sensors, and integrated circuits, offering an optimal combination of throughput and reliability for production lines.