Used Accretech TSK HRG3000RMⅡ

The Accretech HRG3000RMⅡ is a fully automated, dual-spindle wafer grinding machine designed for the high-efficiency, mass-production thinning of 300mm wafers.

Key Positioning and Features

Dual-Spindle High-Efficiency Grinding: Equipped with separate spindles for rough and fine grinding, the system performs both processes sequentially within a single unit. This eliminates the need for intermediate wafer handling, significantly boosting throughput while reducing the risk of wafer breakage—a critical advantage when processing ultra-thin wafers.

High-Precision Control: Featuring a highly rigid frame and precision feed control, combined with in-line thickness measurement, the system ensures excellent Total Thickness Variation (TTV) and superior surface roughness, meeting the stringent requirements for extreme thinning in advanced packaging applications.

Full Automation Integration: Standard features include FOUP-based wafer transport, automated loading/unloading, and an integrated cleaning unit. It also supports SECS/GEM communication, allowing for seamless integration into 300mm automated mass-production lines.

Process Compatibility: Suitable for silicon, compound semiconductors (such as SiC and GaN), and hard, brittle materials; it also supports the TAIKO thinning process (optional).

Summary

The HRG3000RMⅡ is a core mass-production tool from Accretech, engineered for 300mm advanced packaging and wafer manufacturing lines. By combining the efficiency of dual-spindle grinding with the stability of full automation, it effectively addresses the industry's need for high throughput and low breakage rates in high-volume production.