TEL NS300+ HT wafer cleaner for sale

Short Description:

The TEL NS300+ HT is a fully automated, high-temperature, single-wafer cleaning system designed for 300mm wafers.

Product Detail

TEL Wafer Cleaner NS300+ HTThe TEL NS300+ HT is a fully automated, high-temperature, single-wafer cleaning system designed for 300mm wafers. It is a production-ready model based on the NS300 platform, enhanced specifically for high-temperature chemical processes—most notably, SPM-based photoresist stripping.

Core Focus: High-Temperature SPM Processing

The "HT" in the model name stands for "High Temperature." Building upon the single-wafer, spin-cleaning architecture of the NS300, this system features upgraded chemical delivery and temperature control subsystems. It is purpose-built for high-temperature, strongly oxidizing cleaning processes—such as SPM (sulfuric acid + hydrogen peroxide)—to efficiently remove stubborn photoresist and organic polymers remaining after ion implantation or etching.

Key Technical Features

Precise High-Temperature Chemical Control: Because the SPM process is highly sensitive to temperature, the NS300+ HT incorporates specialized high-temperature chemical piping and thermal control modules. This ensures a stable mixing ratio of sulfuric acid and hydrogen peroxide, as well as consistent reaction temperatures, enabling high stripping rates while minimizing byproduct residues.

High Reliability and Safety: Designed for high-temperature, highly corrosive environments, the process chamber, spray lines, and drainage systems are constructed from materials with superior corrosion resistance. The system also includes robust exhaust treatment and comprehensive safety interlock mechanisms.

High-Throughput Automation: Equipped with standard FOUP loading/unloading capabilities and supporting the SECS/GEM communication protocol, the system delivers high throughput and integrates seamlessly into fully automated 300mm production lines.

Summary

Centered on the high-temperature SPM process, the NS300+ HT is engineered to address demanding photoresist stripping and organic cleaning challenges in the production of advanced logic, memory, and advanced packaging. It serves as a critical wet-processing tool for maintaining pattern integrity and ensuring high product yields.

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