TEL Wafer Cleaner ZETA™＋200/300

The TEL (Tokyo Electron) ZETA™+ 200/300 is a fully automated single-wafer cleaning system designed for the precision cleaning of 200mm and 300mm wafers in advanced manufacturing processes.

Core Focus: Gentle yet Highly Efficient Physical Cleaning

The system’s primary innovation is its ZETA™ non-contact cleaning technology. By utilizing megasonic waves in combination with specialized fluids, it effectively removes fine particles and contaminants without ever making physical contact with the wafer surface. This non-contact mechanism prevents the scratches or pattern collapse often associated with traditional brush-based cleaning, making it ideal for delicate advanced packaging, ultra-thin wafers, and surfaces with intricate, fine-featured patterns.

Automation and Process Integration

The system employs a single-wafer processing mode and features fully automated FOUP (Front Opening Unified Pod) loading/unloading, along with factory automation interfaces (SECS/GEM), to support high-throughput, high-volume production. It offers flexible support for various chemical mixtures and precise temperature control, enabling it to address diverse process requirements—such as post-CMP cleaning, post-grinding cleaning, and pre-bonding surface preparation.

Summary

Leveraging its unique non-contact megasonic cleaning technology, the ZETA™+ 200/300 delivers a highly compatible and stable cleaning solution for 200mm and 300mm production lines, while ensuring an exceptionally low defect rate.