KAIJO FB-e18 Fully Automatic Thermosonic Gold Ball Bonder for sale

The KAIJO FB-e18 is a fully automatic thermosonic ball bonder (gold wire bonder) manufactured by the Japanese company KAIJO. It is primarily used to interconnect IC and LED chips to printed circuit boards (PCBs) or lead frames using gold wire.

Core Specifications and Performance

This equipment offers a well-balanced combination of precision and speed. It features a bonding repeatability of ±2.5 µm (3σ) and a bonding area of 56 mm × 80 mm. In terms of efficiency, the bonding time per wire is just 43 ms (based on a 2 mm wire length). It supports gold wire diameters ranging from 12 to 75 µm and is capable of forming stable FABs (Free Air Balls). The system is equipped with a high-speed, high-precision image processing engine and a CCD camera to ensure accurate alignment of bond points.

Operation and Positioning

The FB-e18 utilizes a Windows-based operating interface designed for ease of use. It accommodates lead frames up to 295 mm × 90 mm and offers an optional dual-frequency ultrasonic transducer to suit various process requirements. In the market, this model is typically used for gold wire bonding applications, making it well-suited for semiconductor and LED packaging scenarios that demand high bonding precision and stability.

Most FB-e18 units currently available on the market are pre-owned, with many originating from production batches manufactured around 2018.