Used ASM AD838L-Plus

The AD838L-Plus is a die bonder from ASMPT. Part of the company’s AD series, it is designed for high-volume die-bonding applications within advanced packaging production lines. As a die bonder, its primary function is the high-precision placement of bare dies onto substrates or wafers; it is not used for testing or thin-film deposition.

Process Application: The system is utilized for flip-chip bonding, die stacking in 2.5D/3D packaging, and die placement for fan-out packaging. It addresses the critical requirements for high-precision alignment and stable bonding between the die and the substrate, falling under the category of back-end packaging processes. Within ASMPT’s product portfolio, the AD series represents a specific tier of placement precision and automation. The "Plus" suffix denotes an enhanced configuration compared to the base model, typically offering improvements in alignment accuracy, throughput, or process versatility.

Design Focus: The system emphasizes high-precision visual alignment and bonding stability. It is equipped with advanced motion control and vision systems, supports flexible switching between various packaging recipes, and balances high-volume throughput with high placement yield. The platform is engineered for production-line cycle times and operational stability, making it well-suited for high-volume packaging scenarios that demand high placement precision.

Classification: As a die bonder, it belongs to the back-end packaging equipment category—distinct from tools used for thin-film deposition or electroplating. Along with ASMPT’s PHOTON and MEGA series, as well as Canon’s BESTEM series, the AD838L-Plus addresses the precision requirements for die placement in advanced packaging. In short, the AD838L-Plus is one of ASMPT’s high-volume production models designed for the die-bonding stage of advanced packaging.