ASM AMICRA AFC Plus

The ASM AMICRA AFC Plus is a fully automated sub-micron die-bonding/flip-chip bonding system from ASMPT, distinguished by its ultra-high precision and modular flexibility. It offers a placement accuracy of up to ±0.5 μm @ 3σ (with some configurations rated at ±1 μm) and a cycle time of less than 30 seconds. The system supports eutectic bonding (via diode laser or heating plate), epoxy dispensing/stamping, wafer mapping, and automated loading/unloading. Optional features include active alignment, flip-chip bonding, and UV curing. It is primarily designed for high-precision, high-volume production applications in fields such as micro-optics, MEMS, optoelectronics, and advanced packaging (including TSV and 3D die stacking).