PVA TePla IoN Series In-line Atmospheric-Pressure Plasma Cleaning Platform

The PVA TePla IoN series consists of in-line, atmospheric-pressure plasma cleaning platforms designed for semiconductor packaging, electronic assembly, and panel-level manufacturing. Built around the core design philosophy of "atmospheric pressure, in-line operation, and damage-free processing," the series is specifically engineered for high-throughput, continuous automated production lines.

Core Positioning: Atmospheric-Pressure In-Line Processing

Unlike traditional vacuum plasma systems, the IoN series eliminates the need for costly vacuum chambers and pumping systems. Utilizing atmospheric-pressure plasma technology, these units can be integrated directly into a customer’s automated production line, performing continuous cleaning and activation as workpieces—such as lead frames, substrates, or panels—are transported through the system, thereby significantly increasing production throughput.

Key Features and Technical Advantages

Atmospheric-Pressure, Stress-Free Processing: By avoiding the vacuum evacuation process, the system prevents physical stress on sensitive components. This makes it particularly well-suited for ultra-thin chips, Micro-Electro-Mechanical Systems (MEMS), and fragile advanced packaging structures.

Uniform and Flexible Plasma Field: Through an optimized nozzle array and gas flow design, the system generates a stable, uniform plasma in an open environment. It supports a variety of process gases—such as Ar, O₂, and N₂—to address specific requirements, including the removal of organic contaminants, enhancement of surface energy, and improvement of adhesion for bonding or encapsulation.

Modularity and Scalability: The IoN series offers models with varying processing widths and capacities (e.g., IoN 40, 100, 200, etc.), allowing for flexible selection based on production line throughput requirements—from single-track configurations to wide-format panel processing.

High-Level Automated Integration: Equipped with standard SMEMA interfaces and support for SECS/GEM communication protocols, the systems integrate seamlessly into factory Manufacturing Execution Systems (MES), enabling automated recipe deployment and process data traceability.

Conclusion

With its high-efficiency, damage-free, atmospheric-pressure in-line processing capabilities and flexible integration, the PVA TePla IoN series serves as a critical dry-cleaning solution for enhancing yields and throughput in sectors such as advanced packaging, automotive electronics, and panel-level packaging.