Used DISCO DFG8340

The DISCO DFG8340 is a fully automatic, single-spindle wafer grinding machine designed for the high-volume backside thinning of 300mm wafers. It serves as the primary model within DISCO’s platform for large-diameter wafer grinding.

Core Positioning: A Mainstay for 300mm Mass Production

Unlike the DFG8020—which is designed for wafers 200mm in diameter and smaller—the DFG8340 is configured as standard to process 300mm (Φ300mm) wafers. Featuring fully automated loading, unloading, and wafer transport, it is purpose-built for high-volume backside thinning production lines, including those for advanced logic chips, memory devices, and large-format power components (such as IGBTs).

Key Technical Features

High Precision and Low Damage: Equipped with a high-rigidity spindle and precision feed control, the system supports both coarse and fine grinding (with an optional in-line thickness measurement feature). This ensures that the Total Thickness Variation (TTV) and surface roughness meet the stringent requirements for ultra-thin wafers.

Automated Integration: The system supports FOUP-based wafer transport and can be integrated with cleaning units. This minimizes the need to move wafers between different machines, thereby reducing the risk of breakage for large-diameter, thin wafers.

Process Compatibility: The machine is compatible with silicon, compound semiconductors, and hard, brittle materials; it also supports the TAIKO thinning process (as an optional feature).

Summary

The DFG8340 is a core piece of equipment for 300mm production lines, enabling high-throughput, high-yield backside thinning. Its level of automation and processing precision meet the rigorous demands for ultra-thin wafers in both advanced packaging and wafer manufacturing.