Used TEL NS300Z

The TEL NS300Z is a fully automated, single-wafer cleaning system designed for 300mm wafers. As part of TEL’s well-established NS300 series, it is primarily utilized for high-precision cleaning processes in advanced logic, memory, and advanced packaging manufacturing.

Core Positioning: A Proven, High-Throughput Platform

The NS300Z retains the series’ signature single-wafer, spin-processing architecture. Wafers are processed on a chuck through sequential stages of chemical dispensing, deionized water rinsing, and drying. This single-wafer approach eliminates cross-contamination and allows for millisecond-level precision in controlling chemical exposure times—meeting the stringent, ultra-low defect rate requirements of advanced process nodes.

Key Technical Features

Optimized Fluid and Drying Control: The process chamber is precision-engineered to manage airflow patterns and drainage paths. Combined with a sophisticated drying process, this effectively prevents watermarks and particle re-adhesion, ensuring a high level of surface cleanliness.

Flexible Multi-Chemical Compatibility: The system supports the mixing and delivery of various chemicals—such as SC1, diluted HF, and O₃-infused water—enabling it to efficiently address diverse cleaning requirements, including post-CMP, post-etch, and pre-bonding applications.

High-Throughput Automation: Equipped with standard FOUP loading/unloading capabilities and SECS/GEM communication protocols, the system delivers high throughput and integrates seamlessly into fully automated 300mm high-volume production lines.

Summary

With its refined fluid control and high operational stability, the NS300Z serves as a core wet-processing tool for 300mm production lines, ensuring consistent cleaning performance and improved manufacturing yields.