Used TSK ChaMP332

The TSK (Accretech) ChaMP 332 is a high-end, fully automated Chemical Mechanical Polishing (CMP) system designed for 300mm (12-inch) wafers. It represents the latest planarization technology from Accretech (Tokyo Seimitsu) for advanced manufacturing processes and complex packaging applications.

Core Positioning: Precision Planarization for Advanced Packaging

As a premium model in the ChaMP series, the 332 builds upon the platform’s proven ability to manage warpage in large-diameter wafers. It is further optimized to meet the stringent, nanometer-scale surface roughness requirements of cutting-edge processes, including 3D ICs, HBM (High Bandwidth Memory) stacking, TSV (Through-Silicon Via) exposure, and hybrid bonding.

Key Technical Features

High-Precision Multi-Zone Pressure Control: Equipped with a next-generation polishing head featuring a higher density of independently controlled pressure zones, the system achieves exceptional Within-Wafer Non-Uniformity (WIWNU). It minimizes dishing and erosion, ensuring the extreme surface flatness required for hybrid bonding.

Fully Automated Closed-Loop Control and Multi-Chamber Architecture: The system integrates high-precision in-line film thickness metrology and endpoint detection, enabling a "polish-measure-feedback" closed-loop control cycle. Its modular design—incorporating multiple polishing platens and cleaning chambers—ensures ultra-high cleanliness while delivering superior high-volume throughput.

Compatibility with Hard/Brittle Materials and Advanced Processes: Beyond standard silicon-based dielectric and metal CMP, the system offers excellent support for the planarization of hard and brittle materials, such as SiC (Silicon Carbide). Additionally, the wafer transport mechanism has been optimized for ultra-thin wafers, effectively reducing the risk of wafer breakage.

Summary

With its superior surface flatness control, intelligent closed-loop metrology, and high-throughput automated architecture, the ChaMP 332 serves as a critical CMP solution for overcoming extreme planarization challenges in 300mm advanced manufacturing, HBM stacking, and hybrid bonding production lines.