Accretech PG3000RMⅡ Fully Automatic Dual-Spindle Wafer Grinder

The Accretech (Tokyo Seimitsu) PG3000RMⅡ is a fully automated, dual-spindle wafer grinding system designed for the high-volume back-grinding and precision processing of 300mm wafers.

Key Features

Efficient Dual-Spindle Grinding: Featuring a dual-spindle configuration for rough and fine grinding, the system allows both processes to be completed sequentially on a single platform. This minimizes wafer handling and transfer, thereby increasing throughput while reducing the risk of breakage for ultra-thin wafers.

High Precision and Stability: A highly rigid machine frame, combined with precise feed control and in-line thickness measurement, ensures excellent Total Thickness Variation (TTV) and superior surface quality—meeting the stringent wafer-thinning requirements of advanced packaging.

Ultra-Thin Wafer Handling and Automation: The system comes standard with FOUP-based wafer transport, automated loading/unloading, and an integrated cleaning unit, with handling mechanisms specifically optimized for ultra-thin wafers. It supports SECS/GEM communication, enabling seamless integration into automated 300mm production lines.

Summary

The PG3000RMⅡ is a core production tool from Accretech, engineered for 300mm wafer manufacturing and advanced packaging lines. It balances high throughput with exceptional processing precision, making it well-suited for the back-grinding of various materials, including silicon and compound semiconductors.