Used DISCO DFG8640

The DISCO DFG8640 is a fully automated, dual-spindle wafer grinding machine designed for the high-efficiency, mass-production backside thinning of 300mm wafers.

Core Positioning

As a high-end model within DISCO’s 300mm grinding platform, the DFG8640 features a dual-spindle design that enables continuous rough and fine grinding on a single unit. This eliminates the need for intermediate wafer handling, significantly boosting throughput while reducing the risk of breakage for ultra-thin wafers.

Key Features

High Precision and High Throughput: Independent control of the dual spindles, combined with in-line thickness measurement, ensures excellent TTV (Total Thickness Variation) and surface quality, meeting the stringent requirements for ultra-thin wafers in advanced packaging.

Full Automation Integration: Equipped with standard FOUP handling and automated loading/unloading, as well as an integrated cleaning unit, the system supports SECS/GEM communication for seamless integration into 300mm automated production lines.

Process Compatibility: Suitable for silicon, compound semiconductors (SiC, GaN), and hard, brittle materials. It also supports the TAIKO thinning process (optional) to effectively manage edge-stress issues.

Summary

The DFG8640 serves as a core piece of equipment for high-volume backside thinning in 300mm wafer manufacturing and advanced packaging lines. It strikes an optimal balance between dual-spindle grinding efficiency and the stability of a fully automated system, making it ideal for production environments that demand high throughput and low wafer-breakage rates.