Used PVA TePla TECHNICS 400 Inline / PS400 Plasma Etching and Resin Stripping System

The PVA TePla TECHNICS 400 Inline (PS400) is an in-line microwave plasma etching and ashing system, specifically designed for high-volume, automated processing within semiconductor packaging production lines.

Core Positioning: An In-line Mass-Production Platform for Packaging Lines

Unlike batch-type chamber systems, the PS400 utilizes an in-line architecture. It integrates automated wafer loading and motion control, allowing for seamless incorporation into packaging production lines to facilitate continuous-flow processing. Its primary applications include surface cleaning and activation of substrates or lead frames prior to processes such as die attach, wire bonding, flip-chip underfilling, and encapsulation (molding).

Key Technical Features

Microwave Plasma and Electrode-free Design: The system employs a 2.45 GHz microwave source that feeds energy into the chamber through a window in the chamber wall. As there are no electrodes inside the chamber, the risk of metal contamination is fundamentally eliminated—making it ideal for packaging processes that are highly sensitive to cleanliness.

Fully Automated In-line Control: Equipped with precision wafer handling and automated loading units, the system manages loading/unloading, substrate rotation, and process parameters—such as etching intensity, duration, and depth—to meet the high-throughput requirements of mass-production lines.

Robust Industrial Architecture: Featuring a stainless-steel frame with integrated water, electrical, and vacuum protection systems, the equipment ensures long-term, stable operation within the environment of a packaging production facility.

Summary

The PS400 is a classic, high-volume production model from PVA TePla for in-line plasma processing in the packaging sector (succeeded by the GIGA 690 model). By leveraging electrode-free microwave plasma technology and full in-line automation, it serves high-volume cleaning, activation, and ashing requirements within OSAT (Outsourced Semiconductor Assembly and Test) and other semiconductor packaging production lines.