Used Ebara F-REX200X CMP System

The Ebara F-REX200X is a fully automated chemical mechanical polishing (CMP) system designed for 200mm (8-inch) wafers. As part of Ebara’s classic F-REX series, it boasts a large installed base across production lines for mature-node and specialty semiconductor processes.

Core Positioning: A Highly Efficient and Stable Platform for Mass Production

This system is primarily used for the global planarization of dielectric layers (such as SiO₂ or low-k materials) and metal layers (such as copper or tungsten) on wafer surfaces. Leveraging Ebara’s expertise in fluid control and pad conditioning technology, the F-REX200X delivers consistent performance in terms of within-wafer non-uniformity (WIWNU) and low defect rates, making it widely used in the manufacturing of logic chips, memory devices, and power semiconductors.

Key Technical Features

Multi-Platen Configuration: Typically equipped with multiple platens, the system allows for flexible combinations of rough and fine polishing processes. This ensures high throughput while effectively controlling phenomena such as "dishing" and "erosion" during polishing.

Precision Polishing Head Control: The polishing head features independent zonal pressure control, which dynamically adjusts pressure based on the wafer’s surface topography—significantly improving edge-to-edge flatness on 200mm wafers.

Integrated Cleaning and Endpoint Detection: The system includes an in-line cleaning module that performs brush-scrubbing and drying immediately after polishing, minimizing particle contamination. It is also equipped with an endpoint detection system (utilizing optical monitoring or motor current analysis) to ensure precise process termination and prevent over-polishing.

Summary

With its stable multi-platen polishing capabilities, precise localized pressure control, and highly integrated cleaning modules, the Ebara F-REX200X serves as a core production tool for achieving high-quality global planarization in 200mm mature-node manufacturing lines.