PVA TePla TECHNICS GIGA 690 for sale

The PVA TePla TECHNICS GIGA 690 is a batch plasma etching and resist removal system, representing PVA TePla's flagship platform for semiconductor back-end packaging and wafer-level processing.

Core Positioning: It is not a single-wafer processing device, but rather processes multiple cartridges simultaneously (supporting up to 6 magazines) via a batch product carrier, emphasizing high throughput and suitable for high-volume surface treatment and cleaning of BGAs, leadframes, PCBs, and wafers.

Key Technical Features: GHz Plasma and Electrode-Free Design: Utilizing GHz microwave plasma technology, an aluminum chamber with a ceramic viewing window, and an electrode-free chamber, it fundamentally avoids the risk of metal contamination, which is especially critical for sensitive devices.

Flexible Application Coverage: Primarily used for pre-molding activation, pre-wire bonding cleaning, pre-filling treatment of flip chips, and pre-mounting treatment of solder balls.

Scalable Configuration: In addition to standalone units, Inline or Autofab (fully automated cluster) versions are available to adapt to production line requirements with varying levels of automation. In summary, the GIGA 690 is a mature, mass-production model from PVA TePla in the field of high-volume plasma processing. With its electrode-free GHz plasma technology and flexible platform scalability, it serves high-volume cleaning, activation, and resist removal processes in packaging, MEMS, and specialty process lines.