Used AG Associates Heatpulse 8800

The AG Associates Heatpulse 8800 is a classic single-wafer Rapid Thermal Processing (RTP) system, primarily used for processes such as Rapid Thermal Annealing (RTA).

Core Focus: Precise Thermal Budget Control

The primary value of this system lies in its exceptionally high heating and cooling rates—with programmable heating rates ranging from 1 to 180°C/second. This capability effectively minimizes the time wafers spend at high temperatures, allowing for precise control over the thermal budget. Such control is critical for applications including dopant activation following ion implantation, silicide formation, and the creation of ultra-shallow junctions.

Key Specifications and Features

Wafer Compatibility: Supports standard 5, 6, and 8-inch wafers, utilizing a fully automated cassette-to-cassette robotic wafer-handling system.

Temperature Capabilities: The recommended steady-state operating range is 400–1200°C. For 8-inch wafers at 1150°C, the system achieves within-wafer uniformity of ±5°C and wafer-to-wafer repeatability within ±3°C.

Process Versatility: Supports various atmospheres, including N₂ and O₂; suitable for processes such as post-implantation annealing, thermal oxidation/nitridation, silicide annealing, and contact alloying.

Current Support: As a legacy system, it is currently supported by Plasma-Therm, which provides spare parts, on-site service, and upgrade options.

Summary

The Heatpulse 8800 was the flagship RTP model from AG Associates during the 200mm wafer era. Renowned for its rapid thermal ramp rates and precise, single-wafer temperature control, it remains a vital tool for annealing and thin-film growth processes in mature manufacturing nodes that require strict thermal budget management.