Used ASM AD211Plus-II

The AD211Plus-II is a die bonder from ASMPT, belonging to the AD series placement platform, designed for the mass production needs of advanced packaging lines. It is a pick-and-place machine responsible for high-precision placement of bare dies onto substrates or wafers, rather than a testing or thin-film deposition device.

Process Positioning: Used for flip-chip placement, 2.5D/3D package chip stacking, and chip placement in fan-out packages. Its core function is to solve the problem of high-precision alignment and stable placement between the chip and the substrate, belonging to the back-end packaging process. The AD211Plus-II is the second-generation "Plus" enhanced version of the AD211 platform. The "II" in the model name indicates a generational upgrade, typically with optimizations in motion control, vision alignment, or throughput.

Design Focus: Emphasizes high-precision vision alignment and placement stability, equipped with a precision motion control and vision system, supporting flexible switching between multiple packaging formulations, and balancing mass production throughput and placement yield. As an upgraded model, it offers improvements in production line cycle time, uptime, and changeover efficiency compared to the basic model, making it suitable for mass production packaging scenarios that require both placement accuracy and overall efficiency.

Positioning Analysis: Belonging to the placement category of packaging equipment, it is located in the back-end packaging stage, belonging to a different process segment than thin film deposition and electroplating equipment. It, along with ASMPT's PHOTON and MEGA series and Canon's BESTEM series, covers the accuracy requirements for advanced packaged chip placement. In short, the AD211Plus-II is one of ASMPT's mass production models in the advanced packaging placement stage; specific configurations are subject to official specifications.