TSK ChaMP232 for sale

The TSK (Accretech) ChaMP 232 is a fully automated Chemical Mechanical Polishing (CMP) system designed for 300mm (12-inch) wafers. It serves as a key platform for Accretech in the fields of advanced packaging and specialty process technologies.

Core Positioning: A Precision Planarization Tool for Advanced Packaging and Large-Format Specialty Processes

With the widespread adoption of 2.5D/3D integration, Fan-Out packaging, and TSV (Through-Silicon Via) technologies, the surface flatness of 300mm wafers has become a critical factor influencing the quality of subsequent bonding and lithography steps. The ChaMP 232 is specifically engineered to address these requirements; it also provides exceptional process support for the substrate fabrication of large-format compound semiconductors, such as SiC and GaN.

Key Technical Features

High Planarity and Stress-Free Processing: To mitigate the risk of warpage in large 300mm wafers, the system utilizes an optimized polishing head and chuck architecture. It achieves superior local planarity—essential for applications like TSV reveal or metal layer planarization—while effectively managing stress to minimize the risk of wafer breakage.

Multi-Station Continuous Operation: The system integrates highly efficient cleaning and drying modules, enabling in-situ cleaning immediately after the polishing process. This prevents slurry residue and particle re-adhesion, meeting the stringent cleanliness standards required for advanced packaging.

Flexible Process Compatibility: The system allows for precise adjustments to slurry supply and polishing pressure, accommodating a wide range of materials—including oxides, metals, and hard, brittle substances—and facilitating a seamless transition from R&D to high-volume production.

Summary

With its outstanding control over the flatness of large-format wafers, strong process adaptability for advanced packaging, and highly integrated automation capabilities, the ChaMP 232 stands as an indispensable CMP production tool for 300mm specialty process and advanced packaging manufacturing lines.